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general description the max16904 is a small, synchronous buck converter with integrated high-side and low-side switches. the device is designed to deliver 600ma with input voltages from +3.5v to +28v while using only 25a quiescent current at no load. voltage quality can be monitored by observing the pgood signal. the max16904 can oper- ate in dropout by running at 97% duty cycle, making it ideal for automotive and industrial applications. the max16904 operates at a 2.1mhz frequency, allow- ing for small external components and reduced output ripple. it guarantees no am band interference. sync input programmability enables three frequency modes for optimized performance: forced fixed-frequency operation, skip mode (ultra-low quiescent current of 25a), and synchronization to an external clock. the max16904 can be ordered with spread-spectrum fre- quency modulation, designed to minimize emi-radiated emissions due to the modulation frequency. the max16904 is available in a thermally enhanced, 3mm x 3mm, 10-pin tdfn package or a 16-pin tssop package. the max16904 operates over the -40c to +125c automotive temperature range. applications automotive industrial military high-voltage input-power dc-dc applications features ? wide +3.5v to +28v input voltage range ? tolerates input voltage transients to +42v ? 600ma minimum output current with overcurrent protection ? fixed output voltages (+3.3v and +5v) ? 2.1mhz switching frequency with three modes of operation 25? ultra-low quiescent current skip mode forced fixed-frequency operation external frequency synchronization ? optional spread-spectrum frequency modulation ? power-good output ? enable-pin compatible from +3.3v logic level to +42v ? thermal shutdown protection ? -40? to +125? automotive temperature range ? 10-pin tdfn-ep or 16-pin tssop-ep packages ? aec-q100 qualified max16904 2.1mhz, high-voltage, 600ma mini-buck converter ________________________________________________________________ maxim integrated products 1 19-5481; rev 2; 3/11 evaluation kit available part spread spectrum temp range pin- package max16904ratb__/v+ disabled -40c to +125c 10 tdfn-ep* MAX16904RAUE__/v+ disabled -40c to +125c 16 tssop-ep* max16904satb__/v+ enabled -40c to +125c 10 tdfn-ep* max16904saue__/v+ enabled -40c to +125c 16 tssop-ep* ordering information for pricing, delivery, and ordering information, please contact maxim direct at 1-888-629-4642, or visit maxim? website at www.maxim-ic.com. note: insert the desired suffix letters (from selector guide ) into the blanks to indicate the output voltage. alternative output volt- ages available upon request. + denotes a lead(pb)-free/rohs-compliant package. /v denotes an automotive qualified part. * ep = exposed pad. selector guide appears at end of data sheet.
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 2 _______________________________________________________________________________________ max16904_50/v+ 20k 2.2 f 33k en sync gnd v bat level signal pgood bias sup * place input supply capacitors as close as possible to the sup pin. see the applications information section for more details. 4.7 f bst 0.1 f 4.7 h lx 10 f pgnd 5v at 600ma outs max16904_33/v+ 20k 2.2 f 33k en sync gnd v bat level signal pgood bias sup 4.7 f bst 0.1 f * * 3.3 h lx 10 f pgnd 3.3v at 600ma outs typical operating circuits
max16904 2.1mhz, high-voltage, 600ma mini-buck converter _______________________________________________________________________________________ 3 absolute maximum ratings electrical characteristics (v sup = +14v, t a = t j = -40c to +125c, unless otherwise noted. typical values are at t a = +25c, unless otherwise noted.) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. note 1: package thermal resistances were obtained using the method described in jedec specification jesd51-7, using a four- layer board. for detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial . (voltages referenced to gnd.) sup, en..................................................................-0.3v to +42v bst to lx..................................................................-0.3v to +6v lx..............................................................-0.3v to (v sup + 0.3v) bst .........................................................................-0.3v to +47v outs ......................................................................-0.3v to +12v sync, pgood, bias............................................-0.3v to +6.0v pgnd to gnd .......................................................-0.3v to +0.3v lx continuous rms current .................................................1.0a outs short-circuit duration ......................................continuous esd protection human body model .........................................................2kv machine model ..............................................................200v continuous power dissipation (t a = +70c) tdfn (derate 24.4 mw/c above +70c)......................1951mw tssop (derate 26.1 mw/c above +70c) ...................2089mw operating temperature range .........................-40c to +125c junction temperature ......................................................+150c storage temperature range .............................-65c to +150c lead temperature (soldering, 10s) .................................+300c soldering temperature (reflow) .......................................+260c package thermal characteristics (note 1) tdfn junction-to-ambient thermal resistance ( ja ) ...........41c/w junction-to-case thermal resistance ( jc ) ..................9c/w tssop junction-to-ambient thermal resistance ( ja ) ........38.3c/w junction-to-case thermal resistance ( jc ) ..................3c/w parameter symbol conditions min typ max units (note 2) 3.5 28 supply voltage range v sup t < 1s 42 v en = low 4 8 en = high, no load 25 35 a supply current i sup en = high, continuous, no switching 1 ma v uvlo bias rising 2.8 3 3.2 uv lockout v uvlo,hys hysteresis 0.4 v bias voltage v bias +5.5v v sup +42v 5 v bias current limit i bias 10 ma buck converter v out = 5v, fixed frequency -2.0% 5 +2.5% v out,5v v out = 5v, skip mode (note 3) -2.0% 5 +4% v out = 3.3v, fixed frequency -2.0% 3.3 +2.5% voltage accuracy v out,3.3v v out = 3.3v, skip mode (note 3) 6v v sup 18v, i load = 0 to 600ma, t a = -40c to +125c -2.0% 3.3 +4% v
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 4 _______________________________________________________________________________________ electrical characteristics (continued) (v sup = +14v, t a = t j = -40c to +125c, unless otherwise noted. typical values are at t a = +25c, unless otherwise noted.) parameter symbol conditions min typ max units skip-mode peak current i skip 350 ma high-side dmos rds on r on,hs v bias = 5v 400 800 m low-side dmos rds on r on,ls 250 450 m dmos peak current-limit threshold i max 0.85 1.05 1.22 a soft-start ramp time t ss 7 8 9 ms lx rise time t rise,lx 5 ns minimum on-time t on 80 ns pwm switching frequency f sw internally generated 1.925 2.1 2.275 mhz sync input frequency range f sync 1.8 2.6 mhz spread-spectrum range ss spread-spectrum option only +6 % pgood v thr,pgd v out rising 93 pgood threshold v thf,pgd v out falling 88 91 94 % pgood debounce t deb 10 s pgood high leakage current i leak,pgd t a = +25c 1 a pgood output low level v out,pgd sinking 1ma 0.4 v logic lev el s v ih,en 2.4 en level v il,en 0.6 v en input current i in,en v en = v sup = +42v, t a = +25c 1 a v ih,sync 1.4 sync switching threshold v il,sync 0.4 v sync internal pulldown r pd,sync 200 k thermal protection thermal shutdown t shdn 175 c thermal shutdown hysteresis t shdn,hys 15 c note 2: when the typical minimum on-time of 80ns is violated, the device skips pulses. note 3: guaranteed by design; not production tested.
max16904 2.1mhz, high-voltage, 600ma mini-buck converter _______________________________________________________________________________________ 5 typical operating characteristics (v sup = +14v, t a = +25?, unless otherwise noted.) efficiency vs. load current max16904 toc01 load current (a) efficiency (%) 0.5 0.4 0.3 0.2 0.1 10 20 30 40 50 60 70 80 90 100 0 0 0.6 5v, skip mode 5v, fff mode 3.3v, fff mode 3.3v, skip mode no-load supply current vs. input voltage (skip mode) max16904 toc02 input voltage (v) supply current ( a) 26 24 22 20 18 16 14 12 10 8 10 20 30 40 50 60 0 628 5v part 3.3v part line regulation (i load = 600ma) max16904 toc03 input voltage (v) output voltage change (%) 26 24 8 10 12 16 18 20 14 22 -3 -2 -1 0 1 2 3 4 -4 628 load regulation max16904 toc04 load current (a) output-voltage change (%) 0.5 0.4 0.1 0.2 0.3 -3 -2 -1 0 1 2 3 4 -4 0 0.6 skip mode fff mode shutdown supply current vs. input voltage max16904 toc05 input voltage (v) supply current ( a) 26 24 22 20 18 16 14 12 10 8 3 6 9 12 15 0 628 startup response (i load = 600ma) max16904 toc06 1ms/div v en 5v/div i l 1a/div v out 5v/div v pgood 5v/div shutdown waveform (i load = 600ma) max16904 toc07 i inductor 0.5a/div pgood 5v/div v out 5v/div en 5v/div 20 s/div
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 6 _______________________________________________________________________________________ load transient response (3.3v, fixed mode) max16904 toc08 40 s/div 600ma i l 500ma/div 100ma v out 50mv/div ac-coupled 5v v bias 5v/div 5v v pgood 5v/div load transient response (3.3v, skip mode) max16904 toc09 40 s/div 600ma i l 500ma/div 100ma v out 50mv/div ac-coupled 5v v bias 5v/div 5v v pgood 5v/div load transient response (5v, fixed mode) max16904 toc10 40 s/div 600ma i l 500ma/div 100ma v out 50mv/div ac-coupled 5v v bias 5v/div 5v v pgood 5v/div load transient response (5v, skip mode) max16904 toc11 40 s/div 600ma i l 500ma/div 100ma v out 50mv/div ac-coupled 5v v bias 5v/div 5v v pgood 5v/div undervoltage pulse (cold crank) max16904 toc12 10ms/div v sup 10v/div v out 5v/div i load 500ma/div v pgood 5v/div standby current vs. load current max16904 toc13 i load (ma) i in ( a) 0.1 50 100 150 200 250 300 350 400 450 500 0 0.01 1 typical operating characteristics (continued) (v sup = +14v, t a = +25c, unless otherwise noted.)
max16904 2.1mhz, high-voltage, 600ma mini-buck converter _______________________________________________________________________________________ 7 pin description pin tdfn-ep tssop-ep name function 1 1 bst bootstrap capacitor for high-side driver (0.1f) 2 2, 3 sup voltage supply input. connect a 4.7f ceramic capacitor from sup to pgnd. place the capacitor very close to the sup pin. for the tssop-ep package, connect both sup pins together for proper operation. 3 4, 5 lx buck switching node. lx is high impedance when the device is off. for the tssop package, connect both lx pins together for proper operation. 4 6, 7 pgnd power ground. for the tssop-ep package, connect both pgnd pins together for proper operation. 5 8 outs buck regulator voltage-sense input. bypass outs to pgnd with a 10f or larger x7r ceramic capacitor. 6 11 pgood open-drain power-good output. external pullup resistor required for automatic skip mode operation. 7 12 sync sync input. sync allows the device to synchronize to other supplies. when connected to gnd or unconnected, skip mode is enabled under light loads. when connected to a clock source or bias, forced pwm mode is enabled. 8 13 bias +5v internal logic supply. connect a 2.2f ceramic capacitor from bias to gnd. 9 14 gnd analog ground 10 15 en enable input. en is high-voltage compatible. drive en high for normal operation. 9, 10, 16 n.c. no connection. not internally connected. ep exposed pad. connect ep to pgnd. do not use ep as the only ground co nnection. max16904 + 5 6 outs pgood 4 top view 7 pgnd sync 3 8 lx bias 2 9 sup gnd 1 tdfn 10 bst en ep max16904 + 8 9 outs n.c. 7 10 pgnd n.c. 6 11 pgnd pgood 3 14 sup gnd 2 15 sup en 1 16 bst n.c. 5 12 lx sync 4 tssop 13 lx bias ep pin configurations
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 8 _______________________________________________________________________________________ functional diagram max16904 lsd pwm eamp comp hsd bias lx pgnd bst sup logic control current-sense and slope compensation soft-start osc bandgap gnd v good pgood outs bias hvldo sync ref en clk
max16904 2.1mhz, high-voltage, 600ma mini-buck converter _______________________________________________________________________________________ 9 detailed description the max16904 is a small, current-mode buck converter that features synchronous rectification and requires no external compensation network. the device is designed for 600ma output current, and can stay in dropout by running at 97% duty cycle. it provides an accurate out- put voltage within the +6.5v to +18v input range. voltage quality can be monitored by observing the pgood signal. the device operates at 2.1mhz (typ) frequency, which allows for small external components, reduced output ripple, and guarantees no am band interference. the device features an ultra-low 25a (typ) quiescent supply current in standby mode. standby mode is entered when load currents are below 5ma and when sync is low. the device operates from a +3.5v to +28v supply voltage and tolerates transients up to +42v, making it ideal for automotive applications. the device is available in factory-trimmed output voltages from 1.8v to 10.7v in 100mv steps. contact the factory for availability of voltage options. enable (en) the device is activated by driving en high. en is com- patible from a +3.3v logic level to automotive battery levels. en can be controlled by microcontrollers and automotive key or can inhibit signals. the en input has no internal pullup/pulldown current to minimize overall quiescent supply current. to realize a program- mable undervoltage lockout level, use a resistor- divider from sup to en to gnd. bias/uvlo the device features undervoltage lockout. when the device is enabled, an internal bias generator turns on. lx begins switching after v bias has exceeded the inter- nal undervoltage lockout level v uvlo = 3v (typ). soft-start the device features an internal soft-start timer. the out- put voltage soft-start ramp time is 8ms (typ). if a short circuit or undervoltage is encountered, after the soft- start timer has expired, the device is disabled for 30ms (typ) and it reattempts soft-start again. this pattern repeats until the short circuit has been removed. oscillator/synchronization and efficiency (sync) the device has an on-chip oscillator that provides a switching frequency of 2.1mhz (typ). depending on the condition of sync, two operation modes exist. if sync is unconnected or at gnd, the device must operate in highly efficient pulse-skipping mode if the load current is below the skip mode current threshold. if sync is at bias or has a frequency applied to it, the device is in forced pwm mode. the device offers the best of both worlds. the device can be switched during operation between forced pwm mode and skip mode by switch- ing sync. skip mode operation skip mode is entered when the sync pin is connected to ground or is unconnected and the peak load current is < 350ma (typ). in this mode, the high-side fet is turned on until the current in the inductor is ramped up to 350ma (typ) peak value and the internal feedback voltage is above the regulation voltage (1.2v typ). at this point, both the high-side and low-side fets are turned off. depending on the choice of the output capacitor and the load current the high-side fet turns on when outs (valley) drops below the 1.2v (typ) feed- back voltage. achieving high efficiency at light loads the device operates with very low quiescent current at light loads to enhance efficiency and conserve battery life. when the device enters skip mode the output cur- rent is monitored to adjust the quiescent current. when the output current is < 5ma, the device operates in the lowest quiescent current mode also called the stand- by mode. in this mode, the majority of the internal circuit- ry (excluding that necessary to maintain regulation) in the device, including the internal high-voltage ldo, is turned off to save current. under no load and with skip mode enabled, the device draws only 25a (typ) current. for load currents > 5ma, the device enters normal skip mode while still maintaining very high efficiency. controlled emi with forced-fixed frequency in forced pwm mode, the device attempts to operate at a constant switching frequency for all load currents. for tightest frequency control, apply the operating frequen- cy to sync. the advantage of this mode is a constant switching frequency, which improves emi performance; the disadvantage is that considerable current can be thrown away. if the load current during a switching cycle is less than the current flowing through the induc- tor, the excess current is diverted to gnd. with no external load present, the operating current is in the 10ma range. extended input voltage range in some cases, the device is forced to deviate from its operating frequency independent of the state of sync. for input voltages above 18v, the required duty cycle to regulate its output may be smaller than the minimum on-time (80ns, typ). in this event, the device is forced to lower its switching frequency by skipping pulses.
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 10 ______________________________________________________________________________________ if the input voltage is reduced and the device approaches dropout, it tries to turn on the high-side fet continuously. to maintain gate charge on the high- side fet, the bst capacitor must be periodically recharged. to ensure proper charge on the bst capacitor when in dropout, the high-side fet is turned off every 6.5s and the low-side fet is turned on for about 150ns. this gives an effective duty cycle of > 97% and a switching frequency of 150khz when in dropout. spread-spectrum option the device has an optional spread-spectrum version. if this option is selected, then the internal operating fre- quency varies by +6% relative to the internally generat- ed operating frequency of 2.1mhz (typ). spread spectrum is offered to improve emi performance of the device. by varying the frequency 6% only in the posi- tive direction, the device still guarantees that the 2.1mhz frequency does not drop into the am band limit of 1.8mhz. additionally, with the low minimum on-time of 80ns (typ) no pulse skipping is observed for a 5v output with 18v input maximum battery voltage in steady state. the internal spread spectrum does not interfere with the external clock applied on the sync pin. it is active only when the device is running with internally generat- ed switching frequency. power-good (pgood) the device features an open-drain power-good output. pgood is an active-high output that pulls low when the output voltage is below 91% of its nominal value. pgood is high impedance when the output voltage is above 93% of its nominal value. connect a 20k (typ) pullup resistor to an external supply or the on-chip bias output. overcurrent protection the device limits the peak output current to 1.05a (typ). to protect against short-circuit events, the device shuts off when outs is below 1.5v (typ) and one overcurrent event is detected. the device attempts a soft-start restart every 30ms and stays off if the short circuit has not been removed. when the current limit is no longer present, it reaches the output voltage by following the normal soft-start sequence. if the device die reaches the thermal limit of +175c (typ) during the current-limit event, it immediately shuts off. thermal-overload protection the device features thermal-overload protection. the device turns off when the junction temperature exceeds +175c (typ). once the device cools by 15c (typ), it turns back on with a soft-start sequence. applications information inductor selection three key inductor parameters must be specified for operation with the device: inductance value (l), peak inductor current (i peak ), and inductor saturation current (i sat ). the minimum required inductance is a function of operating frequency, input-to-output voltage differen- tial, and the peak-to-peak inductor current ( i p-p ). higher i p-p allows for a lower inductor value, while a lower i p-p requires a higher inductor value. a lower inductor value minimizes size and cost, improves large-signal and transient response, but reduces effi- ciency due to higher peak currents and higher peak-to- peak output-voltage ripple for the same output capacitor. on the other hand, higher inductance increases efficiency by reducing the ripple current. resistive losses due to extra wire turns can exceed the benefit gained from lower ripple current levels especial- ly when the inductance is increased without also allow- ing for larger inductor dimensions. a good compromise is to choose i p-p equal to 30% of the full load current. use the following equation to calculate the inductance: v in and v out are typical values so that efficiency is optimum for typical conditions. the switching frequency is ~2.1mhz. the peak-to-peak inductor current, which reflects the peak-to-peak output ripple, is worse at the maximum input voltage. see the output capacitor sec- tion to verify that the worst-case output ripple is accept- able. the inductor saturation current is also important to avoid runaway current during continuous output short circuit. the output current may reach 1.22a since this is the maximum current limit. choose an inductor with a saturation current of greater than 1.22a to ensure prop- er operation and avoid runaway. input capacitor the discontinuous input current of the buck converter causes large input ripple current. the switching frequen- cy, peak inductor current, and the allowable peak-to- peak input-voltage ripple dictate the input capacitance requirement. increasing the switching frequency or the inductor value lowers the peak-to-average current ratio yielding a lower input capacitance requirement. the input ripple comprises mainly of v q (caused by the capacitor discharge) and v esr (caused by the l vvv vf i out in out in sw p p = ? ? ()
max16904 2.1mhz, high-voltage, 600ma mini-buck converter ______________________________________________________________________________________ 11 esr of the input capacitor). the total voltage ripple is the sum of v q and v esr . assume the input-voltage ripple from the esr and the capacitor discharge is equal to 50% each. the following equations show the esr and capacitor requirement for a target voltage rip- ple at the input: where: and: where i out is the output current, d is the duty cycle, and f sw is the switching frequency. use additional input capacitance at lower input voltages to avoid pos- sible undershoot below the uvlo threshold during tran- sient loading. output capacitor the allowable output-voltage ripple and the maximum deviation of the output voltage during step load cur- rents determine the output capacitance and its esr. the output ripple comprises of v q (caused by the capacitor discharge) and v esr (caused by the esr of the output capacitor). use low-esr ceramic or alu- minum electrolytic capacitors at the output. for alu- minum electrolytic capacitors, the entire output ripple is contributed by v esr . use the esr out equation to cal- culate the esr requirement and choose the capacitor accordingly. if using ceramic capacitors, assume the contribution to the output ripple voltage from the esr and the capacitor discharge to be equal. the following equations show the output capacitance and esr requirement for a specified output-voltage ripple. where: i p-p is the peak-to-peak inductor current as calculated above and f sw is the converters switching frequency. the allowable deviation of the output voltage during fast transient loads also determines the output capaci- tance and its esr. the output capacitor supplies the step load current until the converter responds with a greater duty cycle. the response time (t response ) depends on the closed-loop bandwidth of the convert- er. the devices high switching frequency allows for a higher closed-loop bandwidth, thus reducing t response and the output capacitance requirement. the resistive drop across the output capacitors esr and the capacitor discharge causes a voltage droop during a step load. use a combination of low-esr tan- talum and ceramic capacitors for better transient load and ripple/noise performance. keep the maximum out- put-voltage deviations below the tolerable limits of the electronics being powered. when using a ceramic capacitor, assume an 80% and 20% contribution from the output capacitance discharge and the esr drop, respectively. use the following equations to calculate the required esr and capacitance value: where i step is the load step and t response is the response time of the converter. the converter response time depends on the control-loop bandwidth. pcb layout guidelines careful pcb layout is critical to achieve low switching power losses and clean stable operation. use a multilayer board wherever possible for better noise immunity. refer to the max16904 evaluation kit for recommended pcb layout. follow these guidelines for a good pcb layout: 1) the input capacitor (4.7f, see the applications schematic in the typical operating circuits ) should be placed right next to the sup pins (pins 2 and 3 on the tssop-ep package). because the device operates at 2.1mhz switching frequency, this placement is critical for effective decoupling of high-frequency noise from the sup pins. esr v i c it v out esr step out step response q = = i vv v vf l v pp in out out in sw out ripple ? = ? () _ ? ?+ ? vv esr q esr v i c i vf esr pp out pp qsw = = ? ? 8 d v v out in = i vv v vf l pp in out out in sw ? = ? () esr v i i c idd esr out pp in out = + ? ? ? ? ? ? = ? ? 2 1 ( ) ) vf qsw
max16904 2.1mhz, high-voltage, 600ma mini-buck converter 12 ______________________________________________________________________________________ 2) solder the exposed pad to a large copper plane area under the device. to effectively use this copper area as heat exchanger between the pcb and ambi- ent, expose the copper area on the top and bottom side. add a few small vias or one large via on the copper pad for efficient heat transfer. connect the exposed pad to pgnd ideally at the return terminal of the output capacitor. 3) isolate the power components and high current paths from sensitive analog circuitry. 4) keep the high current paths short, especially at the ground terminals. the practice is essential for stable jitter-free operation. 5) connect the pgnd and gnd together preferably at the return terminal of the output capacitor. do not connect them anywhere else. 6) keep the power traces and load connections short. this practice is essential for high efficiency. use thick copper pcb to enhance full load efficiency and power dissipation capability. 7) route high-speed switching nodes away from sensi- tive analog areas. use internal pcb layers as pgnd to act as emi shields to keep radiated noise away from the device and analog bypass capacitor. esd protection the devices esd tolerance is rated for human body model and machine model. the human body model discharge components are c s = 100pf and r d = 1.5k (figure 1). the machine model discharge components are c s = 200pf and r d = 0 (figure 2). figure 1. human body esd test circuit storage capacitor high- voltage dc source device under test charge-current- limit resistor discharge resistance 1m r d 1.5k c s 100pf storage capacitor high- voltage dc source device under test charge-current- limit resistor discharge resistance r d 0 c s 200pf figure 2. machine model esd test circuit
max16904 2.1mhz, high-voltage, 600ma mini-buck converter ______________________________________________________________________________________ 13 chip information process: bicmos selector guide part output voltage (v) pin-package spread-spectrum switching frequency top mark max16904ratb50/v+ 5 10 tdfn-ep* (3mm x 3mm x 0.75mm) ? avy MAX16904RAUE50/v+ 5 16 tssop-ep* (5mm x 4.4mm) ?? max16904satb50/v+ 5 10 tdfn-ep* (3mm x 3mm x 0.75mm) yes awa max16904saue50/v+ 5 16 tssop-ep* (5mm x 4.4mm) yes ? max16904ratb33/v+ 3.3 10 tdfn-ep* (3mm x 3mm x 0.75mm) ? avx MAX16904RAUE33/v+ 3.3 16 tssop-ep* (5mm x 4.4mm) ?? max16904satb33/v+ 3.3 10 tdfn-ep* (3mm x 3mm x 0.75mm) yes avz max16904saue33/v+ 3.3 16 tssop-ep* (5mm x 4.4mm) yes ? MAX16904RAUE18/v+ 1.8 16 tssop-ep* (5mm x 4.4mm) ?? note: all devices operate over the -40c to +125c automotive temperature range. + denotes a lead(pb)-free/rohs-compliant package. /v denotes an automotive qualified part. * ep = exposed pad. package type package code outline no. land pattern no. 10 tdfn-ep t1033+1 21-0137 90-0003 16 tssop-ep u16e+3 21-0108 90-0120 package information for the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages . note that a +, #, or - in the package code indicates rohs status only. package drawings may show a different suffix character, but the drawing pertains to the package regardless of rohs status.
max16904 2.1mhz, high-voltage, 600ma mini-buck converter maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. 14 ____________________maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 ? 2011 maxim integrated products maxim is a registered trademark of maxim integrated products, inc. revision history revision number revision date description pages changed 0 9/10 initial release 1 11/10 added new output voltage trim to selector guide 12 2 3/11 updated the voltage accuracy and the dmos peak current-limit threshold parameters in the electrical characteristics , updated tocs 1, 6, and 8C13 3, 4, 5, 6

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